High thermal conductivity thermal epoxy resin products Product Name: High thermal conductivity thermal epoxy resin products
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Product List: New products

Low specific gravity super high thermal conductivity epoxy resin ( A / B )

Application: potting by high-precision electronic product, cooling by high-end radiator

Type: Two-component epoxy resin

Overview: Low-specific gravity ultra-high thermal conductivity series is a series of low-filling, retaining all kinds of excellent properties of epoxy itself under the condition of maximizing heat conduction, with excellent electrical properties, low density and low thermal expansion coefficient and super high Thermal conductivity, good temperature resistance, and convenient drop casting.

Mixed description:

1. Accurately weigh 10 parts by weight of A glue (black) and B glue (colorless);

2. If the A glue is thicker, it can be heated to lower the viscosity (heated at 60 °C for 20 minutes), depending on the actual situation;

3. Mix thoroughly, scrape the corners and bottom material in the container and mix well;

4. Conditional vacuum degassing of the mixed sample (recommended condition: temperature 60 degrees, pressure: -0.08, time: 20 minutes. Try not to exceed -0.1 atmospheres. If the bubble is obviously overflowing, it should be closed in time. Drop the vacuum and take out the sample. Clean the spilled parts with a solvent such as ethanol or acetone. Do not allow the spilled sample to solidify in a vacuum facility.

5. Fill into the component or mold.

Curing time and conditions:

Condition: curing at room temperature,

Curing time: 12-24 hours, it is recommended to smash the mold after 24 hours to ensure complete curing

Remarks: All our productsare low-specific gravity ultra-high thermal conductivity products, the density is less than 2, are the one of best products. At present, the product C series is not suitable for vacuum degassing because spillage may occur when the vacuum is greater than -0.08.

 

 

Performance parameters before curing       

Product A Series Product B Series Product C Series

Color, Visibility: black black black

Viscosity (cps): 22000-25000 14000-16000 22000-26000

Specific gravity (g/cm 3 ): 1.8-2.2 1.4-1.6 1.5-2.1

Liquid heat conduction (W/m*k): 1.1-1.7 1.1-2.5 1.0-2.1

Mixed viscosity (cps): 5000-7600 4000-7000 4000-8000

Curing time: 24h 24h 24h

Shelf life: 12 months 12 months 12 months    

Physical parameters after curing

Hardness test: (Shore hardness D) 91 81 86

Compressive strength (psi): 27500 23000 25000

Thermal expansion coefficient (°C): 28×10 -6          26×10 -6         24×10 -6 

Thermal deformation temperature (°C): 160 140 140

Thermal conductivity (W/m*K): 1.2-1.8 1.1-2.6 1.1-2.2

Effective temperature range (°C): -40-180 -40-180 -40-180   

Electronic performance

Insulation strength, volts/mil: 500 500 500

Insulation constant, 1Kz: 6.5 6.2 6.3

Dissipation coefficient, 1Kz: 0.025 0.026 0.024

 

Remarks:

The above performance data are some typical experimental data obtained under the condition of 298K and humidity 70% . It is only for reference when the customer uses it. The thermal conductivity is obtained by the transient method and can be retested by instruments such as HOT-DISK .

 

Product Guidance of Hangzhou Longman New Material Co., Ltd. 

	Model	A glue colour	B glue colour	Specific gravity (g/cm 3 )	Applicable temperature (°C)	Weight ratio	Thermal conductivity (W/m*K)	Applicable range
Epoxy A series	A-001	white	colorless	2.5	-40-140	10:1	0.9	potting of General circuit board, underwater light seal waterproof
	A-002	black	colorless	1.6	-20-140	10:1	1.1	Circuit board sealing, sealing heat dissipation of sensor
	A-003	black	colorless	1.8	-20-140	10:1	1.4	cooling of Circuit board, cooling of electronic device
	A-004	black	colorless	2.3	-20-140	10:1	1.5	Thicker, special needs, please consult our technical department
	A-005	black	colorless	2.6	-20-140	10:1	1.8	Thicker, special needs, please consult our technical department
Epoxy B series	B-001	black	colorless	1.35	-20-140	10:1	1.1	cooling of Circuit board, cooling of electronic device
	B-002	black	colorless	1.4	-20-140	10:1	1.2	cooling of Circuit board, cooling of electronic device
	B-003	black	colorless	1.5	-20-140	10:1	1.4	cooling of Circuit board, cooling of electronic device
	B-004	black	colorless	1.6	-20-140	10:1	1.6	cooling of Circuit board, cooling of electronic device
	B-005	black	colorless	1.7	-20-140	10:1	1.8	cooling of Circuit board, cooling of electronic device
	B-006	black	colorless	1.9	-20-140	10:1	2.1	Thicker, strong heat sink
	B-007	black	colorless	2.2	-20-140	10:1	2.4	Thicker, special needs, please consult our technical department
	B-008	black	colorless	2.4	-20-140	10:1	2.6	Thicker, special needs, please consult our technical department
Epoxy C series	C-001	black	colorless	1.4	-20-140	10:1	1.1	cooling of Circuit board, CPU cooling
	C-002	black	colorless	1.6	-20-140	10:1	1.2	Radiator cooling, cooling of Circuit board
	C-003	black	colorless	1.7	-20-140	10:1	1.3	Radiator cooling, cooling of Circuit board
	C-004	black	colorless	1.8	-20-140	10:1	1.4	cooling of Circuit board, cooling of electronic device
	C-005	black	colorless	1.9	-20-140	10:1	1.7	Radiator cooling, cooling of Circuit board
	C-006	black	colorless	2.0	-20-140	10:1	1.9	Thicker, special needs, please consult our technical department
	C-007	black	colorless	2.1	-20-140	10:1	2.0	Thicker, special needs, please consult our technical department
	C-008	black	colorless	2.2	-20-140	10:1	2.2	Thicker, special needs, please consult our technical department

Remarks: our company can produce thermal epoxy resin within 0.3-1.0 according to customer requirements, please consult our technical department.